Ultrasonic Spray Coating of Photoresist for Fan-Out PLP and RDL
Fan-Out and RDL Processing Technology | Panel Level Packaging Photoresist Coating Solution
In modern semiconductor fan-out panel level packaging technology, photoresist material serves as a core patterned functional material, which is widely applied in the precision patterning fabrication of wafer redistribution layers (RDL), microscopic via holes and chip interconnect structures. The performance of photoresist coating directly determines the precision, stability and yield of subsequent circuit patterning, laying a crucial foundation for the overall quality of semiconductor packaging devices.
In actual packaging production, panel surfaces often feature complex three-dimensional topographies with alternating raised circuits and recessed groove structures. Traditional coating methods are prone to uneven film thickness, local material accumulation, missing coating and film breakage at structural edges, which seriously affects the integrity of patterned structures. The advanced ultrasonic spray coating technology can achieve precise and controllable photoresist deposition on complex panel surfaces, effectively adapting to diverse uneven structural morphologies of packaging panels. It stably maintains continuous and complete photoresist film layers on both raised functional areas and recessed tiny structures, solving the common film discontinuity problem in traditional coating processes.
The ultrasonic spray coating mode adopts soft low-velocity atomized spraying principle. Compared with conventional high-pressure spraying, it avoids excessive impact force on tiny precision structures and effectively prevents fine vias and micro-interconnect structures from being flooded and blocked by photoresist materials. This process feature enables the photoresist to form a highly uniform and thin coating layer on the panel surface with consistent thickness and flat texture.
The high-quality uniform photoresist coating provides stable and reliable basic conditions for the follow-up full-process manufacturing. It can ensure excellent consistency in photoresist exposure and development effects, make the patterned circuit and via hole structures more accurate and standardized, and further guarantee the stability and qualification rate of subsequent core processes such as metal layer deposition and circuit etching. This optimized coating process has become an indispensable key technology for high-precision, high-yield fan-out panel level packaging and RDL manufacturing.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
Chinese Website: Cheersonic Provides Professional Coating Solutions
