Ultrasonic Spray Pyrolysis Processing of Indium Oxide Thin Film Transistors

Ultrasonic Spray Pyrolysis Processing of Indium Oxide Thin Film Transistors. Ultrasonic spray pyrolysis technology makes the growth of polycrystalline, highly uniform indium oxide films no longer a problem!

Ultrasonic spray pyrolysis technology is a unique micro-powder preparation technology. It uses ultrasonic atomization technology to uniformly atomize the solution into micron or nano-scale micro mist, and then passes it into a high-temperature environment for thermal cracking or instantaneous solvent evaporation to obtain micro-powder. body. This technology is widely used in scientific research and industrial production due to its high purity, high activity and uniform particle size.

Spray Pyrolysis Processing of Indium Oxide Thin Film Transistors

Recently, ultrasonic spray pyrolysis technology has been successfully used to grow polycrystalline, highly uniform indium oxide films. The researchers used an aqueous solution of In3 precursors to perform spray pyrolysis in the air at a temperature range of 200–300 °C, and successfully prepared high-quality indium oxide films. This kind of film has broad application prospects in optoelectronic devices, sensors and other fields. The successful application of ultrasonic spray pyrolysis technology not only provides a new method for the preparation of indium oxide, but also provides a reference for the preparation of other high-performance materials.

About Cheersonic

Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.

Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.

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