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Ultrasonic Photoresist Coating Machine for AMB Ceramic
Ultrasonic Photoresist Coating Machine for AMB Ceramic AMB ceramic substrate copper plate photoresist exposure and development ultrasonic photoresist coating machine In the field of power semiconductor packaging, AMB (Active Metal Brazing) ceramic substrates have become the core carrier of high-end power modules due to their high thermal conductivity and excellent insulation properties. The copper plate photoresist exposure and development process directly determines the accuracy of circuit graphics and substrate reliability. [...]
