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Process of Spraying Photoresist onto a Silicon Wafer
Process of Spraying Photoresist onto a Silicon Wafer Ultrasonic spraying offers significant advantages in silicon wafer processing. Using high-frequency vibrations, it atomizes the coating into uniform, tiny droplets of 5-30 microns. This creates a uniform coating on the wafer surface with precisely controllable thickness (0.1-5 microns), free of pinholes and buildup, avoiding the uneven thickness and particle agglomeration associated with traditional spraying. Ultrasonic spraying boasts a material utilization rate exceeding [...]
