Ultrasonic Bonding of Sputtering Targets to Backing Plates
Ultrasonic Bonding of Sputtering Targets to Backing Plates Using Indium Ultrasonic Bonding of Sputtering Targets to Backing Plates - Sonic4Lab In the field of magnetron sputtering, the reliable bonding of sputtering targets to backing plates is a critical process that directly affects the performance and service life of sputtering equipment. Ultrasonic soldering bonding using indium as the solder has emerged as a preferred technology due to its unique advantages such [...]
