21 08, 2025

Ultrasonic Spray Coating Electromagnetic Shielding Layer

By |2025-09-16T06:13:16+00:0021 8 月, 2025|Blog|Ultrasonic Spray Coating Electromagnetic Shielding Layer已关闭评论

Ultrasonic Spray Coating Electromagnetic Shielding Layer In the current era of highly integrated electronic devices, electromagnetic signal interference has become a key factor restricting device performance. Ultrasonic spraying machine, as a precision coating equipment, forms a uniform electromagnetic shielding layer on the surface of electronic components through a unique atomization principle, providing an efficient solution to this problem. The core of this technology is to use high-frequency vibration to atomize [...]

21 08, 2025

The Truth About Gold-Plated PCBs: Easy Soldering

By |2025-09-26T05:14:18+00:0021 8 月, 2025|Blog|The Truth About Gold-Plated PCBs: Easy Soldering已关闭评论

The Truth About Gold-Plated PCBs: Easy Soldering Among PCB surface treatments, immersion gold is highly sought after for its long-lasting properties, smooth pads, and excellent solderability. However, its high cost deters many. Many believe its solderability is due to the gold coating, and even believe that the thicker the gold layer, the better the soldering. This is a misunderstanding. The truth is, the excellent solderability of gold-plated boards isn't due [...]

21 08, 2025

Ultrasonic Dispersion Adhesive for Lithium-ion Batteries

By |2025-08-21T04:09:55+00:0021 8 月, 2025|Blog|Ultrasonic Dispersion Adhesive for Lithium-ion Batteries已关闭评论

Ultrasonic Dispersion Adhesive for Lithium-ion Batteries In the multi-component system of lithium-ion batteries, the binder is the core link that maintains the integrity of the electrode structure. It can tightly bond active substances, conductive agents, and current collectors to construct a stable electrode framework - the foundation of this process cannot be separated from the uniformity control of the slurry preparation process. Ultrasonic dispersion lithium-ion battery slurry technology can break [...]

20 08, 2025

Slicing Cheesecakes into Triangles

By |2025-08-18T07:45:10+00:0020 8 月, 2025|Blog|Slicing Cheesecakes into Triangles已关闭评论

Slicing Cheesecakes into Triangles Unleash your creativity with precision cutting: Ultrasonic technology adds geometric beauty to your cheesecakes. In the modern baking world, where efficiency and quality are paramount, every detail matters to your product's appeal and profitability. Imagine your signature cheesecake, no longer limited to traditional round slices, but now precisely and elegantly cut into perfectly sized, smooth-edged triangles—all efficiently performed by automated ultrasonic cutting equipment, without the need [...]

20 08, 2025

Ultrasonic Coating of Precursor Solutions

By |2025-08-08T04:31:13+00:0020 8 月, 2025|Blog|Ultrasonic Coating of Precursor Solutions已关闭评论

Ultrasonic Coating of Precursor Solutions Process Principle Ultrasonic coating utilizes high-frequency ultrasonic vibrations (typically 20–120 kHz) to atomize a precursor solution into micron-sized droplets (typically in the 1–50 μm range). These droplets are then directed onto the substrate surface using a carrier gas (e.g., nitrogen, argon, or other inert gases), ultimately depositing them into a uniform thin film. Its core advantages include: – High-precision uniformity: Narrow droplet size distribution enables [...]

20 08, 2025

Can Vias be Drilled Through Pads?

By |2025-09-26T05:23:02+00:0020 8 月, 2025|Blog|Can Vias be Drilled Through Pads?已关闭评论

Can Vias be Drilled Through Pads? In PCB design, whether vias are necessary depends on the specific scenario and process. In some cases, drilling vias through pads is necessary. For example, to improve heat dissipation for large devices like MOSFETs, vias are often drilled on the backside of the pads. In this case, the holes should be evenly spaced to ensure uniform heating. However, the biggest problem with this approach [...]

20 08, 2025

Why do conductive agents need ultrasonic dispersion?

By |2025-08-21T04:25:34+00:0020 8 月, 2025|Blog|Why do conductive agents need ultrasonic dispersion?已关闭评论

Why do conductive agents need ultrasonic dispersion? The use of ultrasonic dispersion technology to uniformly disperse conductive agents (such as carbon nanotubes, graphene, Ketchen black, acetylene black, etc.) is crucial for preparing high-performance electrodes, especially in the fields of lithium-ion batteries, capacitors, etc. Conductive agents, especially nanoscale materials such as CNTs and graphene, have extremely high specific surface area and strong van der Waals forces, making them prone to agglomeration [...]

20 08, 2025

Preparation of Protective Coatings for Integrated Circuits

By |2025-09-16T06:15:27+00:0020 8 月, 2025|Blog|Preparation of Protective Coatings for Integrated Circuits已关闭评论

Preparation of Protective Coatings for Integrated Circuits In the highly integrated electronic age, the long-term reliable operation of integrated circuits (ICs) has surpassed simple technological pursuits and become a core proposition related to system vitality. The harsh and ever-changing external environment - ubiquitous moisture, corrosive chemical media, and high temperature stress - constantly challenges the physical and electrical integrity of chips. In this context, ultrasonic spraying technology stands out with [...]

19 08, 2025

Ultrasonic Cutting Fudge-Barfis

By |2025-08-18T03:17:28+00:0019 8 月, 2025|Blog|Ultrasonic Cutting Fudge-Barfis已关闭评论

Ultrasonic Cutting Fudge-Barfis Cutting India's most popular fudge-Barfis India is a festival country, and every family prepares traditional delicious food, especially sweets. Among Indian desserts, barfi is the most beloved. When it comes to barfi, the first thought that comes to mind is Kaju Barfi made from cashews. However, if you dig deeper, you will be amazed by its rich and diverse ingredients, such as leaves, sesame, almonds, chocolate, etc., [...]

19 08, 2025

Packaging Barrier Coatings

By |2025-08-08T04:29:47+00:0019 8 月, 2025|Blog|Packaging Barrier Coatings已关闭评论

Packaging Barrier Coatings Amid the global trend toward eco-friendly packaging, traditional laminating and laminating processes are facing acute challenges such as material waste, high carbon emissions, and limited functionality. Ultrasonic spraying technology, with its micron-level precision deposition capabilities, is reshaping the upgrade path for packaging materials. It empowers eco-friendly substrates with nano-level functional coatings, achieving breakthrough improvements in barrier properties, strength, and intelligent responsiveness, while also driving packaging manufacturing [...]