Defect-Free Joining of Sputtering Targets and Backplanes
Defect-Free Joining of Sputtering Targets and Backplanes Application of Ultrasonic Welding Systems in Defect-Free Joining of Sputtering Targets and Backplanes In high-tech fields such as semiconductors, photovoltaics, and display panels, the quality of the join between sputtering targets and backplanes directly determines device performance and lifespan. During sputtering, the backplane plays a crucial role in supporting the target and efficiently conducting heat. Pores or cracks in the joint can lead [...]
