Ultrasonic Spray Coating for Semiconductor Substrate Insulation
Application of Ultrasonic Spraying Thermal Decomposition Technology in Insulation Coating of Semiconductor Carriers
In the semiconductor industry’s accelerated breakthrough towards advanced packaging, the packaging carrier, as the core connection hub between the chip and external circuits, directly determines the operational stability and lifespan of the device due to its insulation performance. To achieve high-precision and high-reliability coating of the insulating coating on the carrier surface, ultrasonic spraying thermal decomposition equipment, with its unique technical characteristics, has become a key process equipment in the industry, providing core support for the upgrade of advanced packaging technology.
The core advantage of ultrasonic spraying thermal decomposition technology lies in combining ultrasonic atomization with thermal decomposition curing, completely solving the pain points of uneven coating and uncontrolled thickness in traditional coating processes. During equipment operation, high-frequency ultrasonic vibration atomizes the insulating coating precursor solution into tiny droplets with a diameter of only a few micrometers. This atomization method does not require high-pressure airflow assistance, avoiding coating defects caused by droplet splashing and airflow disturbance. Compared with traditional spraying, the droplet size distribution formed by ultrasonic atomization is more concentrated, enabling it to cover the carrier surface with a uniform density, laying a good foundation for subsequent thermal decomposition curing.
Addressing the dense circuitry and complex structure of advanced semiconductor packaging substrates, the equipment is equipped with a high-precision servo control system that can preset the spraying path based on the substrate’s three-dimensional structure. During operation, the nozzle can adjust the spraying speed, droplet flow rate, and spray distance in real time. Especially in complex areas such as pin gaps and grooves on the substrate, decelerated spraying ensures complete liquid film coverage, effectively preventing missed coating. Simultaneously, the equipment’s optical monitoring module provides real-time feedback on coating thickness, controlling errors to the nanometer level, meeting the stringent requirements of advanced packaging for consistent insulating layer thickness.
The thermal decomposition stage is a crucial step determining the performance of the insulating coating. The substrate, after initial coating, is automatically transferred to the thermal decomposition chamber. The chamber employs a zoned temperature control design, creating a gradient temperature field from low-temperature pre-baking to high-temperature decomposition. In the low-temperature stage, the solvent in the liquid film evaporates slowly, preventing coating cracking caused by rapid heating. When the temperature reaches a specific threshold, the precursor material undergoes a chemical reaction, decomposing to form a dense insulating ceramic or polymer layer. The entire thermal decomposition process is conducted under inert gas protection to prevent coating oxidation and ensure that core indicators such as insulation resistance and breakdown voltage meet usage standards.
This coating technology not only improves the insulation performance of the substrate but also significantly enhances its resistance to moisture and heat and corrosion, greatly improving the stability of semiconductor devices under complex operating conditions. Simultaneously, ultrasonic spraying increases material utilization by more than 30% compared to traditional processes, reducing raw material waste and aligning with green manufacturing principles. In today’s increasingly integrated chip market, ultrasonic spraying thermal decomposition equipment, with its precise and efficient technological advantages, is driving the development of advanced semiconductor packaging processes towards higher precision and superior performance, providing crucial support for the research and development of next-generation electronic devices.
About Cheersonic
Cheersonic is the leading developer and manufacturer of ultrasonic coating systems for applying precise, thin film coatings to protect, strengthen or smooth surfaces on parts and components for the microelectronics/electronics, alternative energy, medical and industrial markets, including specialized glass applications in construction and automotive.
Our coating solutions are environmentally-friendly, efficient and highly reliable, and enable dramatic reductions in overspray, savings in raw material, water and energy usage and provide improved process repeatability, transfer efficiency, high uniformity and reduced emissions.
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